Brilliant at the Edge

Leading fabless semiconductor company specializing in ASIC design services, RF IC design,
AI processing, and wireless communication innovation

Core Competencies

RF & Mixed-Signal Design

RF & Mixed-Signal Design

Digital Design & SoC

Digital Design & SoC

Edge AI

Edge AI & Software

Acoustic Systems

Acoustic Systems

Wireless Communication

Wireless Communication

Optical Communication

Optical Communication

LEO ASIC Solutions & Design Services

Breakthrough in Innovation

LEO ASIC Design Service delivers advanced semiconductor solutions tailored to mission-specific requirements. By combining cutting-edge process technologies, deep system integration expertise, and capabilities in RF and Digital Beamforming (DBF) design, we provide end-to-end services—from architecture design and IC development to tape-out and volume production. We empower customers to achieve high-performance, power-efficient, and highly customized chip solutions for next-generation communications and high-speed data transmission.

Innovative Architecture

Excellent Power Efficiency

Versatile Application Support

Technology Node Support

Supporting various advanced process technologies to meet different application requirements

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Advanced Process
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High Performance
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Cost Effective
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Mature Process

Ready to Start Your Next Project?

Contact our professional team to discuss your semiconductor design needs

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